| 摘要 |
PURPOSE:To realize highly reliable connection by mechanically controlling the gap between a semiconductor device and a circuit board at the time of face down connection, by using protrusions whose melting point is higher than bumps, and preventing the semiconductor device from inclining to the circuit board. CONSTITUTION:A plurality of bumps 6 are formed on electrode pads 2 formed on the surface of a semiconductor device 1, and further a plurality of protrusions 8 which are lower than the bumps 6 and composed of material whose melting point is higher than the bumps 6 are formed. The number of stud bumps 8, 8 turning to protrusions defining a gap is desirable to be at least three or more. Metal capable of wire-bonding to the material of the electrode pads 2, e.g. Al, is ordinarily used. Al and Cu also can be used. The melting point is necessary to be higher than the material of the bumps 6. |
