| 发明名称 |
Method of manufacturing a flexible electronic device and flexible device |
| 摘要 |
An electrical element, such as a thin-film transistor, is defined on a flexible substrate, in that the substrate is attached to a carrier by an adhesive layer, and is delaminated after definition of the transistor. This is for instance due to illumination by UV-radiation. An opaque coating is provided to protect any semiconductor material. A heat treatment is preferably given before application of the layers of the transistor to reduce stress in the adhesive layer.
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| 申请公布号 |
US2006194363(A1) |
申请公布日期 |
2006.08.31 |
| 申请号 |
US20040551309 |
申请日期 |
2004.03.30 |
| 申请人 |
GIESBERG JACOBUS B;BEENHAKKERS MONIQUE J;RIJPERT CORNELIS JOHANNUS HERM;GELINCK GERWIN H;TOUWSLAGER FREDERICUS J |
发明人 |
GIESBERG JACOBUS B.;BEENHAKKERS MONIQUE J.;RIJPERT CORNELIS JOHANNUS HERMANUS A.;GELINCK GERWIN H.;TOUWSLAGER FREDERICUS J. |
| 分类号 |
H01L29/08;H01L21/762;H01L21/77;H01L21/84;H01L27/12;H01L29/786;H01L51/00;H01L51/05;H01L51/40 |
主分类号 |
H01L29/08 |
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