摘要 |
In the pressure sensor (11) proposed, the receiver (19), comprising a piezo-resistive thick-film resistance or a piezo-electric material, and the electronic components (23) of an electronic processing circuit are located on the substrate (21) of a hybrid circuit (22). In the vicinity of the receiver (19), the underside of the substrate (21) abuts a stop (25). The stop (25) has through-bores in the vicinity of the electronic components (23). These through-bores (26) provide sufficient installation space for the electronic components (23). In addition, the electronic components (23) can be aligned simply, even when fitted in place, by laser trimming. The pressure sensor is relatively compact in design and can be manufactured cheaply.
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申请人 |
ROBERT BOSCH GMBH, 7000 STUTTGART, DE |
发明人 |
STECHER, GUENTHER, DIPL.-PHYS., 7140 LUDWIGSBURG, DE;HERDEN, WERNER, DIPL.-ING. DR., 7016 GERLINGEN, DE;SCHMIDT, WOLFGANG, 7143 VAIHINGEN, DE;MOSER, MANFRED, DIPL.-ING., 7141 SCHWIEBERDINGEN, DE |