发明名称 MOLDING METHOD OF THERMOSETTING RESIN COMPOSITE MATERIAL
摘要 PURPOSE:To reduce the quantity of excess thickness of a product, and to equalize the board thickness of the product by laminating an uncured composite material blank on a molding die, to a lower section of which a collar extended in the outer circumferential direction is formed, with a material having the same thermal expansion coefficient as a laminate to be molded, arranging a dam so as to be abutted against an end face, the end face of the molding die and the end face of the collar and sealing a sealant. CONSTITUTION:A molding die 1 manufactured of a material having the same thermal expansion coefficient as a laminate 3 to be molded is placed on a discoid jig 4, a dam 13 is disposed onto the collar 2 of the molding die 1 while a semirigid composite material blank 3 is laminated on the molding die 1, and the dam 13 arranged on the collar 2 is positioned so as to be abutted against the end face of the laminate 3 and the end face of the molding die 1 and the end face of the collar 2. A sealant is sealed to the external upper end section and external lower end section of the dam and the end face of the collar respectively, the upper sections of the laminate 3, the dam 13 and the collar 2 are covered with a bagging film 12, space covered with the bagging film 12 is decompressed under a vacuum, and the whole these members are disposed into an autoclave, heated pressed and cured and treated.
申请公布号 JPH0418317(A) 申请公布日期 1992.01.22
申请号 JP19900122167 申请日期 1990.05.11
申请人 FUJI HEAVY IND LTD 发明人 TAGAYA YUTAKA;NISHIKUNI HARUYOSHI
分类号 B29C43/12;B29C43/20;B29C43/36;B29C43/56;B29L31/30 主分类号 B29C43/12
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