EPOXY RESIN AND ENCAPSULATING EPOXY RESIN COMPOSITIONS

摘要

Epoxy resins prepared by reacting a bisphenol-type epoxy resin of the formula: X<1> and X<2> being H, hal or C1-5 alkyl and n a number from 0 to 5 on average, with polyhydric phenols having an average number of hydroxyl groups per molecule of from 2.3 to 10, the reactant ratio being such that per epoxy group of bisphenol-type epoxy resin the number of hydroxyl groups of polyhydric phenols is in the range of 0.05 to 0.6. Encapsulating epoxy resin compositions based on bisphenol-type epoxy resins of the above formula or reaction products thereof.