UNIVERSAL ELECTRICAL INTERCONNECTION SYSTEM AND METHOD

摘要

A carrier preferably in the form of a thin insulative and heat-resistant sheet (14) has a plurality of apertures (26) extending therethrough which are preloaded to carry a reflowable electrically conductive solder (28) or paste. Upon positioning the carrier between lands (18-24) of circuit carriers, printed circuit boards, combinations thereof or the like, predetermined electrical interconnections may be effected between such lands by reflow. The electrical interconnection is completed between given upper and lower such lands through the conductive material in a plurality of apertures disposed between the lands. In a preferred embodiment the aperture density relative to the area of the lands to be interconnected is selected to provide redundancy by permitting plural interconnections through apertures to a given land pair. Aperture diameter and amount of reflowable material present therein is further selected whereby upon such reflowing apertures between adjacent pads act as solder dams to prevent undesirable electrical interconnection between such adjacent pads. A system is provided whereby the carrier need not be precisely aligned relative to the land patterns and whereby necessity for precise screening of conductive material to accommodate fine pitch land/pad configurations is eliminated.