MOUNTING STRUCTURE OF HEAT DISSIPATION MATERIAL FOR SEMICONDUCTOR DEVICE USE,申请号JP19900121845-传众专利搜索

首页产品黄页商标征信

会员服务注册登录

法人/股东/高管

发明名称	MOUNTING STRUCTURE OF HEAT DISSIPATION MATERIAL FOR SEMICONDUCTOR DEVICE USE
摘要
申请公布号	JPH0418747(A)	申请公布日期	1992.01.22
申请号	JP19900121845	申请日期	1990.05.12
申请人	MITSUBISHI ELECTRIC CORP	发明人	YAGOURA HIDEYA;SHIMAMOTO HARUO;KOBAYASHI EIJI
分类号	H01L23/40	主分类号	H01L23/40
代理机构		代理人
主权项
地址

您可能感兴趣的专利

ELECTRIC DECORATION SYSTEM FOR ROLLER SKATING DANCING STAGE

NONAQUEOUS ELECTROLYTE BATTERY

PRACTICE SUIT OF TEA CEREMONY

HEAVY PRESSURE CONTRAFLOW HYDRAULIC GENERATOR

HYDRAULIC CIRCUIT OF CONSTRUCTION MACHINE WITH ATTACHMENT

BLEND OF THERMOPLASTIC ELASTOMER WITH BITUMEN

ELECTRIC MUTUAL CONNECTING DEVICE

DISTANCE MEASURING DEVICE BY ULTRASONIC WAVE

DISPLAYING METHOD FOR STAMPING OF THERMO-CONTRACTIVE SLEEVE

ENGINE WITH TWO PISTON IN ONE CYLINDER

INDICATOR OF WATER TEMPERATURE

THERMOSENSITIVE RECORDING DEVICE

MANUFACTURE OF MESH ELECTRODE FOR CATHODE RAY TUBE

CREST VALUE DETECTION SYSTEM

WIDE-BAND LIGHT WAVE METER

TIME DISPLAY DEVICE

Cable fastener assembly and method of manufacture

Porous core rod

Synthetic thermoplastic moulding materials