| 摘要 |
PURPOSE:To enable a semiconductor integrated circuit device to be packaged to a printed-circuit board highly densely by using a capacitor which is formed by an island part metal of a lead frame, an insulator, and a metal layer as a noise bypass capacitor between power supplies. CONSTITUTION:An island part 1 of a lead frame is connected to a power supply wire which matches a semiconductor substrate potential of a semiconductor integrated circuit chip 4 out of a step part 5 of the lead frame. Then, a capacitor which consists of the island part 1, an insulator 2, and a metal layer 2 is used as a noise bypass capacitor between power supplies. |
