发明名称 LEADLESS COMPONENT SOCKET
摘要 A leadless component socket comprises a socket body of electrically insulative material and planar, substantially parallel, top and bottom surfaces, and a plurality of openings between the surfaces in an array to provide an intended contact pattern. A two-piece spring contact assembly is retained in respective openings, with one element retained within the opening and having an outwardly extending lead for soldering or other connection to a circuit board on which the socket is mounted, and the other element extending above the upper socket surface in a position to engage the confronting terminals of a leadless component or device, such as a leadless chip carrier.
申请公布号 CA1294679(C) 申请公布日期 1992.01.21
申请号 CA19880581825 申请日期 1988.11.01
申请人 AUGAT INC. 发明人 BERTOGLIO, GUIDO;BOYLE, MICHAEL C.;COONEY, JAMES S.;WALKUP, WILLIAM B.
分类号 H01R33/76;H01R4/24;H01R13/24;H05K7/10 主分类号 H01R33/76
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