发明名称 |
LEADLESS COMPONENT SOCKET |
摘要 |
A leadless component socket comprises a socket body of electrically insulative material and planar, substantially parallel, top and bottom surfaces, and a plurality of openings between the surfaces in an array to provide an intended contact pattern. A two-piece spring contact assembly is retained in respective openings, with one element retained within the opening and having an outwardly extending lead for soldering or other connection to a circuit board on which the socket is mounted, and the other element extending above the upper socket surface in a position to engage the confronting terminals of a leadless component or device, such as a leadless chip carrier. |
申请公布号 |
CA1294679(C) |
申请公布日期 |
1992.01.21 |
申请号 |
CA19880581825 |
申请日期 |
1988.11.01 |
申请人 |
AUGAT INC. |
发明人 |
BERTOGLIO, GUIDO;BOYLE, MICHAEL C.;COONEY, JAMES S.;WALKUP, WILLIAM B. |
分类号 |
H01R33/76;H01R4/24;H01R13/24;H05K7/10 |
主分类号 |
H01R33/76 |
代理机构 |
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代理人 |
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主权项 |
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地址 |
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