| 摘要 |
PURPOSE:To prevent peeling of a frame by extending the end part of the electrode plate into a mold resin material from the junction area with a substrate. CONSTITUTION:A diode chip 14 is soldered on a cathode electrode plate 12 through a molybdenum plate 13. The extended anode electrode plate 15 is then soldered to the cathode electrode plate 12 through an insulating plate 19. Moreover, the diode chip 14 and anode electrode plate 15 are connected with an aluminum wire 20. Thereafter, both sides of bending areas 16a, 16b of the anode electrode plate 15 are erected and the cathode electrode plate 12 is coated with a bonding agent for bonding a frame 21. Subsequently, an inner coating material 22 is implanted and is hardened and moreover a mold resin material 23 is implanted and is then hardened. In addition, a cover 24 is attached and a hexagonal nut 27 is engaged with a recessed area 26 for nut insertion. Thereafter, the end part of the bending part of anode electrode plate 15 is bent. |
