| 摘要 |
PURPOSE:To shorten the time required for sorting an article of good quality, by firstly analizing image through pattern recognition in a state of finished wafer process followed by an electrical test for a chip with no pattern defect only. CONSTITUTION:A test chip 1a is tested by visible rays, infrared rays X-rays, electron rays and ultrasonic rays using an image analyzing device to change into image information 10 for accumlation. Said information together with test condition data 12 is put into an analyzer 11 to be treated, and to discriminate the existence of pattern defects and crystal defects, further according to the results of the judgment 13 to discriminate the defective ships from those with no defect. Subsequently, on only the chips with no defect an electric characteristic is tested to discriminate the chips 7 with poor characteristic and deficient margin. Thereby the chips with high reliability, no pattern deficiency satisfying the requirements for a low poor condition rate and with good electric characteristic can be tested in a short time for discrimination. |
