| 摘要 |
An integrated circuit having a superconductive wiring comprises a semiconductor substrate, an integrated circuit device formed on the semiconductor substrate and a wiring connected to the integrated circuit device. The wiring is formed of a superconductive material and has a wide portion for heat radiation. The manufacturing method of the same comprises the steps of preparing a semiconductor substrate, forming an integrated circuit device on the semiconductor substrate, and connecting a wiring having a wide portion for heat radiation and formed of a superconductive material to the integrated circuit device on the semiconductor substrate.
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