| 摘要 |
<p>PURPOSE:To suppress the size of a main surface and to reduce the mounting area by bonding the wire connecting part of a lead side to the section of the lead in a thickness direction. CONSTITUTION:A semiconductor chip 12 is placed on a base 10 by a die bonder by using a lower die 9 formed of glass epoxy resin and formed integrally with a lead 11. In this case, the chip 12 is secured by an adhesive. Then, the electrode 13 of the chip 12 is bonded at the stepped part of the lead in a thickness direction via a wire 14 by a wire bonder, and an upper die 15 is formed by a molding machine to provide a completely assembled product. In a semiconductor device 8 obtained in this manner, since the wire bonded part is bonded to the stepped part of the lead in a thickness direction, the protruding area of the lead toward the main surface of a body can be reduced as compared with a lead bonded to a vertical surface to the thickness direction, and particularly in the case of multipin semiconductor device, its mounting area can be reduced.</p> |
