| 摘要 |
<p>PURPOSE:To obtain the title ink which has excellent heat resistance, flexibility and adhesive properties and is suitable for various wiring boards after low-temp. short-time heat treatment by incorporating polyparabanic acid and an aminated butadiene-acrylonitrile copolymer rubber. CONSTITUTION:In a solder resist ink for a cover coat of a wiring board using a solvent, polyparabanic acid {a synthetic resin of formula I[wherein R is a divalent org. group (e.g. formulas II, III, IV, V, etc., wherein R<1> and R<2> are each H or CH3; (n) is 4-12)]} and an aminated butadiene-acrylonitrile copolymer rubber [e.g. a copolymer of formula VI (wherein R is a prim. or sec. amino group; (n) and (m) are each an integer)] are incorporated as essential ingredients. As this ink has excellent heat resistance, flexibility and adhesive properties at the same time after low-temp. short-time heat treatment, it is suitable for various wiring boards, especially a flexible printed wiring board.</p> |
