| 摘要 |
PURPOSE:To prevent a reduction in an electrical conductivity due to an oxidation of lead wires and corrosion by a method wherein a lead frame is connected with an IC chip by lead wires covered with an insulating film. CONSTITUTION:A semiconductor device constituted by connecting an IC chip 2 with a lead frame 3 by lead wires 1, which are a metal wire la covered with an insulating film 1b, goes through a resin-sealing process and is packaged in a package 4. By such a way, the chip 2 can be connected with the frame 3 by the wires 1 cove red with the film 1b and even if the fellow lead wires 1 come into contact to each other, an electrical contact failure can be prevented because the wires 1 are not electrically connected with each other due to the film lb. Thereby, a reduction in an electrical conductivity due to an oxidation of the lead wires and corrosion can be prevented. |
