| 摘要 |
PURPOSE:To provide a thermosetting resin having good workability and curability, excellent heat resistance and toughness and low dielectric constant and useful for laminate boards by compounding a specific propargyl ether phenol.aromatic hydrocarbon resin, etc. CONSTITUTION:The thermosetting resin comprises a propargyl etherified phenol.aromatic hydrocarbon resin of formula I (R1, R2 are H, CH3; 0<a,b,c<100 and a+b+c=100) and/or propargyl etherified hydroxystyrene.styren copolymer of formula II (0<d,e,f<100 and d+e+f=100). |
