Epoxy resin composition, epoxy resin cured material, and laminated sheet lined with copper.

摘要

An epoxy resin composition comprising: (A) as a resin chief material a bisphenol A type epoxy resin having the following formula (1), wherein n is 0 to 10, R<1> and R<2> each represents a glycidyl group, and A<1> to A<8> each represents a hydrogen atom or a bromine atom; (B) as an epoxy resin curing agent, (b1) a bisphenol A or a brominated product thereof having formula (1) (wherein n is 0, R<1> and R<2> each represents a hydrogen atom, and A<1> to A<4> each represents a hydrogen atom or a bromine atom), or (b2) a novolac resin of a bisphenol A or a brominated product thereof that is obtained by linking two or more molecules of a bisphenol A or a brominated product thereof having formula (1) (wherein n is 0, R<1> and R<2> each represents a hydrogen atom, and A<1> to A<4> each represents a hydrogen atom or a bromine atom), through a methylene group(s) at any of A<1> to A<4>; and (C) as an additive, a polymeric polyhydroxypolyether represented formula (1) (wherein n is 10 to 1,000, R<1> and R<2> each represents an alkyl group or hydroxylated alkyl group, and A<1> to A<8> each represents a hydrogen atom or a bromine atom). a