| 摘要 |
The vacuum ion-plating method for the deposition of thin layers, operates as follows: The substrates on which the thin layers are to be deposited are exposed in a vacuum chamber to a plasma condensed by a magnetic field. The substrates are thus negatively polarized and a percentage of the material to be deposited is ionized after vaporization from an appropriate source. The invention may be placed in the technical field for the deposition of thin layers. The above invention finds some advantageous applications in the industrical field concerning the processing and treatment of metal, glass, resins and other's and generally in the electronic and optical field, etc, etc, for civilian and military uses, wherever there is a requirement for vacuum deposition of thin layers.
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