发明名称 |
PROCESS AND APPARATUS FOR CUTTING UP SEMI-CONDUCTOR BARS INTO DISCS |
摘要 |
<p>Wafers are manufactured from an ingot of semiconductor material by first machining a front face of the ingot to provide a substantially planar reference surface and then slicing the ingot using looped cutting wire apparatus. The cutting wire apparatus includes a looped cutting wire and at least two drive rollers over sectors of which the cutting wire is wrapped. Each drive roller is provided with its own drive motor which has shunt motor characteristics. The speed and torque of each motor is adjustable relative to the load applied to its drive roller by the cutting wire such that all of the drive rollers participate in driving the cutting wire with substantially the same reliability against slippage so that wear is distributed uniformly over all of the drive rollers.</p> |
申请公布号 |
GB2216441(B) |
申请公布日期 |
1992.01.15 |
申请号 |
GB19890003700 |
申请日期 |
1989.02.17 |
申请人 |
* G M N GEORG MUELLER NUERNBERG AG |
发明人 |
HUBERT * HINZEN |
分类号 |
B24B7/22;B24B27/06;B28D1/00;B28D5/04;H01L21/304 |
主分类号 |
B24B7/22 |
代理机构 |
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代理人 |
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主权项 |
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地址 |
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