| 摘要 |
PURPOSE:To enable a wafer to be fitted and removed precisely and efficiently without being broken down by a method wherein the title automatic wafer fitting and removing device is composed of a robot having multiple freely opening and closing pawls to be engaged with the slots in sectionally seen V-shape and flatly seen rectangular shape formed in multiple positions on the outer peripheral part of the recession of a susceptor. CONSTITUTION:The title automatic wafer fitting and removing device 10 is composed of a robot having freely opening and closing three each of pawls at the front ends of its arm 12 while the pawls 11 of the robot are positioned outside the diametral direction of the slots 3 on a susceptor 1 in order to pick up a wafer W contained in the recession 2 of the susceptor 1. When the pawls 11 are closed to be moved inward in the diametral direction, the front ends of respective pawls 11 are moved along the long slopes 3c of the slots 3 so that the front ends of the pawls 11 may creep in the spaces S formed on the outer peripheral rear surface side of the wafer W. In such a constitution, when all the pawls 11 are simultaneously closed by the same amount, the fragile wafer W whose outer periphery is held on the slopes 11a of the pawls 11 by even force will not be broken down.
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