发明名称 TRENCH FORMATION IN A SEMICONDUCTOR MATERIAL
摘要 A semiconductor device is formed on a semiconductor layer. A gate dielectric layer is formed over the semiconductor layer. A layer of gate material is formed over the gate dielectric layer. The layer of gate material is patterned to form a gate structure. Using the gate structure as a mask, an implant into the semiconductor layer is performed. To form a first patterned gate structure and a trench in the semiconductor layer surrounding a first portion and a second portion of the semiconductor layer and the gate, an etch through the gate structure and the semiconductor layer is performed. The trench is filled with insulating material.
申请公布号 US2008217705(A1) 申请公布日期 2008.09.11
申请号 US20070683846 申请日期 2007.03.08
申请人 HALL MARK D;ABELN GLENN C;GRANT JOHN M 发明人 HALL MARK D.;ABELN GLENN C.;GRANT JOHN M.
分类号 H01L29/78;H01L21/336 主分类号 H01L29/78
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