| 摘要 |
<p>PURPOSE:To prevent size larger than substrate one, and to obviate the constraint of the pattern design of a substrate by mounting a semiconductor chip on a surface on the side installed to a carrier of the substrate and housing and sealing the semiconductor chip in the space of a spot facing section formed to the carrier. CONSTITUTION:A semiconductor chip 1 is mounted on a surface on the side set up to a carrier 6 of a substrate 3, and the electrode pads of the semiconductor chip 1 are connected to a pattern formed to the surface on the semiconductor-chip 1 mounting side by bonding wires 2. The semiconductor chip 1 is housed in the space of a spot facing section 7 formed to the carrier 6. The spot facing section 7 is shaped previously in size in which the semiconductor chip 1 housed and the bonding wires 2 are not brought into contact with a wall surface. The substrate 3 is soldered to the carrier 6, through-holes 5 are covered with covers 8, and only the semiconductor chip 1 mounted to the substrate 3 is sealed with the carrier 6.</p> |
