发明名称 FINE PATTERN FORMING METHOD
摘要 <p>PURPOSE:To form high-density printing elements of even 5 to 10mum printing elements by electrodepositing a resin coating material in fine patterns on a substrate for electrodeposition in an conductive layer liquid and transferring this coating material to a pattern forming substrate. CONSTITUTION:A conductive layer 12 is formed on one surface of a glass substrate 11 and an insulating photoresist 13 is formed thereon to desired patterns. This substrate 1 for conductive layer is immersed into the conductive layer liquid 3 of an anion resin dissolved with 14wt.% water-soluble resin coating material 2. The resin coating material 2 is electrodeposited on a conductive release layer 14 when the electrodeposition is executed for two minutes under 50V condition by connecting the conductive layer 12 to a positive electrode. The resin coating material 4 peels from the release layer 14 and is transferred to the pattern forming substrate 5 when the pattern forming substrate 5 made of glass is brought into contact with this electrodeposition resin coating material 4 and +5000V voltage is impressed thereto from the surface.</p>
申请公布号 JPH049902(A) 申请公布日期 1992.01.14
申请号 JP19900112683 申请日期 1990.04.27
申请人 TOPPAN PRINTING CO LTD 发明人 HOSHI HISAO
分类号 G02B5/20;B05C3/09;C25D13/00 主分类号 G02B5/20
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