发明名称 |
MANUFACTURE OF LEAD TERMINAL AND ELECTRONIC PARTS HAVING THE LEAD TERMINAL |
摘要 |
PURPOSE:To increase weldability of electronic parts to electrode surface by a method wherein solder plate of a portion which becomes a weld portion is removed by inserting one end of a terminal material into a hole of a die and the weld portion only is formed into a flat plate-like body. CONSTITUTION:A terminal raw material 1 has a round bar-shaped metallic core wire 1a. A solder plating 1b is formed on the entire surface thereof. The solder plating 1b of the terminal raw material 1 is removed by a die 2. The solder plating 1b in a weld portion 3 is removed by inserting the end portion of the terminal raw material 1 into a hole 2a of the die 2, and a metallic core wire 1a which is a base is exposed. Thereafter, the weld portion 3 is formed into a flat plate-like body by being pressed down by a press, and cut to a length so as to have a plug-in leg 4 with respect to a rotary board from the terminal raw material 1. There is no solder plating in the weld portion 3, and a lead terminal 1' having a solder plating 1b in the portion of the plug-in leg 4 is obtained. The lead terminal 1' is mounted on an electrode surface 5a of electronic parts 5, such as electric double layer or a button type battery. |
申请公布号 |
JPH0410610(A) |
申请公布日期 |
1992.01.14 |
申请号 |
JP19900113702 |
申请日期 |
1990.04.27 |
申请人 |
ELNA CO LTD;ASAHI GLASS CO LTD |
发明人 |
KIMURA YOSHIKATSU;UENO IKUO;KURIHARA KANAME;OKUBO SATORU |
分类号 |
B23K1/00;H01G4/228;H01G11/78;H01G11/84;H01G13/00;H01M2/30 |
主分类号 |
B23K1/00 |
代理机构 |
|
代理人 |
|
主权项 |
|
地址 |
|