Enclosed ferroelectric stacked capacitor

摘要

This invention relates to semiconductor circuit memory storage devices and more particularly to a process to develop three-dimensional stacked cell capacitors using a PZT ferroelectric material as a storage cell dielectric for use in high-density dynamic random access memory (DRAM) arrays. The present invention employs using PZT ferroelectric for the storage cell dielectric in three-dimensional stacked capacitor technology and develops an existing stacked capacitor fabrication process to construct a PZT three-dimensional stacked capacitor cell (the EFSC) that will allow denser storage cell fabrication with minimal increases of overall memory array dimensions. A capacitance gain of 3 to 10X or more over that of a conventional 3-dimensional storage cell is gained by using PZT ferroelectric as the storage cell dielectric.