LIGHT EMITTING DEVICE ARRAY

摘要

The array of the light emitting diodes is bonded to the circuit board by carrying out a single process of die bonding without performing a wire bonding. The array includes: epitaxial layers (11, 11-1) formed on a semiconductor substrate (12) so as for the energy gap of the semiconductor substrate (12) to be lower than the energy gap of the active epitaxial layers (11, 11-1); another epitaxial layer (13) formed in such a manner as to serve as the surface layer of the epitaxial layers (11, 11-1), the layer (13) being divided into a plurality of sub-layers; electrodes formed on the respective sub-layers; and a common electrode (4) formed on the epitaxial layers (11, 11-1).