| 摘要 |
PURPOSE:To prevent spread into a non-cladding part positively by overlapping a metal thin plate with a desired hole, putting chip parts into it for masking, and forming an electrode by vacuum deposition or sputtering. CONSTITUTION:When forming an external electrode terminal at chip parts 1 which mainly consist of ceramic by vacuum deposition, a metal thin plate 2 with a desired hole is overlapped, the chip parts 1 are put into it for masking, and an electrode is formed by vacuum deposition or sputtering. For example, fifteen metal thin plates 2 which has a hole in the same geometry and is 0.1mm thick are overlapped to a fixing tool 3 with four corners as a guide and all laminated ceramic chip capacitors 1 before forming an external electrode are put into a deep hole which is created by it. In that state, upper four sheets 4-7 of the punched metal thin plates 2 are shifted alternately in diagonal direction 8 when the element 1 is viewed from above, and then the drilled metal thin plate 2 is fixed to the fixing tool 3 while the element 1 is clamped so that there is no gap between the element 1 and the drilled metal thin plate 2. |
