MANUFACTURE OF MULTILAYER PLATE

摘要

PURPOSE:To suppress the remaining of voids so as to get a multilayer plate, wherein dimension change and warps are small and a glass unwoven base material prepreg is used, by lowering the molding pressure when the viscosity of the resin within the prepreg is high, and flowing resin compulsively at high pressure when the resin viscosity is high so as to mold it. CONSTITUTION:A circuit is processed in a laminated board, whose both sides are lined with copper and which is obtained by piling up four piles of prepregs A, where glass unwoven fabric is used, and arranging a copper foil each on both sides, and heating and molding it under pressure, and then one ply each of prepreg A and further one ply each of prepreg B, on both sides of this inner layer circuit board, and a copper foil, at the outermost surface, are placed, and the initial molding pressure is set to 20-40kg/cm<2>, and then it is raised to 60-80kg/cm<2> after the resin within the prepreg fuses and reaches the lowest solvent viscosity and before sudden viscosity rise occurs, and after molding it is cooled at a pressure of 5-10kg/cm<2> so as to get a multilayer board.