| 摘要 |
PURPOSE:To secure the high quality and high reliability of a hybrid IC by providing a structure absorbing and mitigating the distortion stress on comb leads. CONSTITUTION:The circuit board 3 of a hybrid IC 17 is inserted into S-shaped holding sections of comb leads 15 with a frame structure, the S-shaped holding sections 14 and the circuit board 3 are connected by soldering, and a connection section 8 with a frame structure is cut off to obtain the preset hybrid IC 17. A printed board 9 absorbs the distortion stress with the elastic action by a flexible structure constituted of the S-shaped holding sections 14, U-shaped bent sections 16 and L-shaped support sections 13 of the comb leads 15, and cracks and ruptures can be prevented from occurring on a solder connection section 11, the comb leads 15 and circuit board 3. |
