| 摘要 |
<p>A metal electronic package (10) is provided having improved electromagnetic interference shielding. Metal base (12) and cover components (14) are electronically interconnected to remain at same voltage potential thereby reducing EMI induced mutual inductance. An electrically conductive conduit, such as a contact pin (48), provides interconnection. If an electronic device (34) is mounted on a chip attach pad (28), the conductive conduit (48) also contacts the pad supports (32) of the chip attach pad (28).</p> |
