发明名称 Coil for surface mounting - has former that responds to heating to adjust shape and vary inductance
摘要 A small coil for use as a surface mounted device on circuit boards has windings (4) connected to end sections formed (2B) for soldered connections to the board. The coil former is produced as two parts with a temp. resistant base (5) and a top section (6). The top section of the former is produced of a material such as wax or plastics which can be warmed during the soldering process to allow the form to change and so permits adjustment of the inductance value. ADVANTAGE - Simple means of adjusting inductance even after being mounted.
申请公布号 DE4020305(A1) 申请公布日期 1992.01.09
申请号 DE19904020305 申请日期 1990.06.26
申请人 SIEMENS AG, 1000 BERLIN UND 8000 MUENCHEN, DE 发明人 LANG, HEINZ, 8000 MUENCHEN, DE
分类号 H01F21/04;H01F27/29 主分类号 H01F21/04
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