| 摘要 |
<p>PURPOSE:To prevent stress that is generated in cutting and bending processes by making a plane of an outer lead part and planes of a bed and an inner lead differ from each other. CONSTITUTION:In lead forming, each lead supporting a bed 11 and an inner lead 16 is bent halfway, and planes of a bed 11 and the inner lead 16, and the plane of an outer lead 17 that extends to the outside from a resin body 18 are made differen from each other in height. Further, a semiconductor chip 13 is bonded to the upper surface of the bed 11 through adhesives 12, and an electrode part 14 of the semiconductor chip 13 is connected to the inner lead 16 by a bonding wire 15. Subsequently, the bed 11, the semiconductor chip 13, and the inner lead 16 are sealed with the resin body 18 and then, a resin sealed semiconductor device is completed by performing cutting and bending processes. Since the planes of the bed and inner lead and the plane of the outer lead are made differ from each other in height, stress that is generated during the cutting and bending processes is prevented from occurring.</p> |
