| 摘要 |
PURPOSE:To obtain the subject composition, composed of a silicone-modified maleimide resin prepared by a specific method, an organic peroxide and triphenylphosphine, good in compatibility and excellent in moisture and heat resistance, low stress characteristics and reliability after dipping thereof in solders. CONSTITUTION:The objective composition is composed of (A) a silicone-modified maleimide resin obtained by reacting (i) 100 pts. wt. polymaleimide with (ii) 30-300 pts.wt. allylated polysiloxane prepared by reacting a dihydro.polysiloxane expressed by formula I (R1 and R2 are 1-4C alkyl or phenyl; n is 1-100) with an allylated phenol.aromatic hydrocarbon resin expressed by formula II (R3 and R4 are H or CH3; a to d are 0-100 and the sum of a to d is 100) and an allylated hydroxystyrene.styrene copolymer resin expressed by formula III (e to h are 0-100 and the sum of e to h is 100) at (2/1)-(10/1) ratio of the allyl/Si- H until the rate of reaction of the Si-H attains >=80% until the melting point of the produced resin attains 50-120 deg.C, (B) an organic peroxide and triphenylphosphine. |
