发明名称 RESIN COMPOSITION AND ELECTRONIC PART MADE THEREOF
摘要 PURPOSE:To obtain a resin composition having excellent water-absorption characteristics, dimensional characteristics and reflow soldering resistance and suitable as a material for electronic part for surface-mounting by compounding a flame-retarded glass-fiber reinforced nylon 46 resin with a specific amount of a specific aliphatic polyamide resin. CONSTITUTION:The objective composition is produced by compounding (A) 100 pts.wt. of nylon 46 resin with (B) 5-100 pts.wt. of an aliphatic polyamide resin having methylene groups and amide groups in the polymer main chain at a number ratio (methylene/amide) of >=6 (e.g. nylon 12, nylon 11, nylon 612 or nylon 66/636 copolymer), (C) 2-100 pts.wt. of a brominated polystyrene, (D) 1-50 pts.wt. of a flame-retarding assistant (preferably antimony trioxide) and (E) 5-200 pts.wt. of glass fiber.
申请公布号 JPH044257(A) 申请公布日期 1992.01.08
申请号 JP19900106842 申请日期 1990.04.23
申请人 TEIJIN LTD 发明人 HIRONAKA KATSUHIKO;NISHIJIMA KIYOAKI
分类号 C08K3/22;C08K7/14;C08L25/18;C08L73/00;C08L77/00;C08L77/06;(IPC1-7):C08L77/06 主分类号 C08K3/22
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