发明名称 Method of etching for integrated circuits with planarized dielectric.
摘要 <p>An integrated circuit design and method for its fabrication are disclosed. A bilevel-dielectric (e.g., 33, 35) is formed to cover the active regions of a transistor and raised topographic features such as a gate runner (e.g., 31 ). The upper level (e.g., 35) of the dielectric is planarized to provide for easier subsequent multilevel-conductor processing. Windows (e.g., 43, 41) are opened in the bilayer dielectric by etching through the upper level (e.g., 35) of the dielectric, stopping on the lower level (e.g., 33) of the dielectric. Then the etch procedure is continued to etch through the lower level (e.g., 33) of the dielectric. &lt;IMAGE&gt;</p>
申请公布号 EP0465044(A2) 申请公布日期 1992.01.08
申请号 EP19910305525 申请日期 1991.06.19
申请人 AMERICAN TELEPHONE AND TELEGRAPH COMPANY 发明人 FAVREAU, DAVID PAUL;SWIDERSKI, JANE ANNE;VITKAVAGE, DANIEL JOSEPH
分类号 H01L21/3065;H01L21/28;H01L21/302;H01L21/311;H01L21/316;H01L21/768 主分类号 H01L21/3065
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