Multiple lamination high density interconnect process and structure employing thermoplastic adhesives having sequentially decreasing Tg's.

摘要

A high density interconnect structure (10) incorporating a plurality of laminated dielectric layers (22,32,42) is fabricated using thermoplastic adhesive layers of progressively lower glass transition temperature in order to maintain the stability of the already fabricated structure during the addition of the later laminations. This structure also facilitates the removal of only a portion of the high density interconnect structure where a fault in the system can be corrected in one of the upper layers of the high density interconnect structure.