| 摘要 |
<p>PURPOSE:To remove wax stuck to a dicer in the cutting of a gallium-arsenic wafer and as well to remarkably reduce the breaking of the wafer, by making the dicer into contact with the dresser before and after every cutting. CONSTITUTION:A dresser 8 having a thickness of, for example, 90mum in the degree of the sum of the thicknesses of a gallium-arsenic (GaAs) wafer 1 and a wax 3, is formed in an L-like shape, and is secured on a support plate 4 in a position near to the GaSa wafer 1. The securing of the dresser 8 is made with the use of a bisurface adhesive tape having a large adhesive force or an adhesive. The reason why the dresser 8 has an L-like shape is such that upon cutting of the GaSa wafer 1 the cutting is made at first in the left and right directions (X-directions) before the cutting in the perpendicular directions (Y-direction) in order to make a dicer 6 cut the dresser 8 even if the cutting is made in either one of both X- and Y- directions. The dicer 6 inevitably cuts the dresser 8 after it cuts the GaSa wafer 1 in one direction, and therefore, it makes into contact with the dresser once in every cutting.</p> |
