| 摘要 |
PURPOSE:To improve the electrical connectability of a viahole by using copper powder as a conductor while adding zinc stearate or/and titania (TiO2) to the conductor and filling a viahole with the conductor. CONSTITUTION:The grain size of copper powder is selected in approximately 1.1mum on an average. The fill of zinc stearate is selected in approximately 0.3-3.0wt.%. When a viahole 3 filled with a conductor 4 constituted, alumina powder is also filled simultaneously. The grain size of the alumina powder is chosen in 0.3-3mum, and loading thereof is 5-10Vol.%. When the viahole is filled with the conductor 4, a protective film 10 is disposed on a surface different from the disposing surface of the mask film 2 of a green sheet 1 so as to close the viahole 3. When the protective film 10 is arranged, the upper section of the conductor 4 is filled with copper paste 4a. The copper paste 4a is filled in the thickness of approximately the half of the thickness (approximately 38mum) of the make film 2. The copper paste 4a is filled by using a rubber squeegee 7 in the same manner as the filling of copper powder. |
