| 摘要 |
<p>PURPOSE:To enable cooling wafers to a uniform temperature by fixing a cooling unit whose dielectric is baked with a channel for carrying refrigerant to cool a dielectric. CONSTITUTION:A dielectric is constituted by depositing an insulating layer 3 on an electrode 2. The dielectric is fixed on a cooling unit 4, inside of which layers a channel 5 for carrying refrigerant. This design allows the heat of a wafer 6 to be conducted to the cooling unit 4 through the dielectric.</p> |
