| 摘要 |
A method and an apparatus for preparing an IC card (4) are disclosed. The method comprises the steps of; a) exposing imagewise a light-sensitive material (14) to form a latent image, b) superposing the exposed material on an image receiving material (1, 12, 33) comprising an image receiving layer, c) developing the superimposed material to form an image by applying heat, d) transferring the image formed in the light-sensitive material (14) to the image receiving layer by applying heat and pressure, e) seperating an image receiving material comprising an image receiving layer having the transferred image from the superimposed material, and f) adhering the image receiving material comprising the image receiving layer having the transferred image to a card comprising a built-in IC device (5). t |
