COMPOSITIONS FOR DIELECTRIC SEALING APPLICATIONS

摘要

A binder suitable for dielectric sealing may be prepared comprising a blend of a polyvinyl halide emulsion and an aqueous emulsion comprising a vinyl ester of an alkanoic acid interpolymerized with a) 5 to 28% by weight of ethylene; b) 0.5 to 4% by a weight of an N-methylol containing copolymerizable monomer; c) 0 to 3% by weight of a latex stabilizer; and d) 0 to 1% by weight of at least one polyunsaturated copolymerizable monomer, the binder having a Tg of -15 to +35 DEG C and being buffered to a pH greater than 7.