Wire bonding method

摘要

A wire bonding method wherein a bonding tool is lowered in a pre-loaded state, and bonding is performed under a bonding load which is smaller than the pre-loading load. The pre-loading load is changed to the bonding load before the bonding tool contacts a bonding point, and the bonding tool contacts the bonding point under such bonding load, thus performing bonding. Such bonding is performed also by changing the pre-loading load into a load which is smaller than the bonding load before the bonding tool contracts a bonding point and further changing such load into the bonding load after the bonding tool has contacted the bonding point.