| 发明名称 |
Repair of open defects in thin film conductors |
| 摘要 |
Open defects in thin film conductor lines on a substrate are repaired by diffusion bonding a selected conductive repair line from a support sheet positioned over the open defect. The diffusion bonding is performed by the application of ultrasonic energy and laser energy.
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| 申请公布号 |
US5079070(A) |
申请公布日期 |
1992.01.07 |
| 申请号 |
US19900595902 |
申请日期 |
1990.10.11 |
| 申请人 |
INTERNATIONAL BUSINESS MACHINES CORPORATION |
发明人 |
CHALCO, PEDRO A.;SAMBUCETTI, CARLOS J. |
| 分类号 |
B23K20/10;B23K26/32;G02F1/13;H05K3/20;H05K3/22;H05K3/24;H05K3/32;H05K3/46 |
主分类号 |
B23K20/10 |
| 代理机构 |
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代理人 |
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| 主权项 |
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| 地址 |
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