Semiconductor device and method of manufacturing semiconductor device

摘要

Provided is a semiconductor device, including: a first substrate that includes a first wiring; a second substrate that is disposed facing the first substrate and includes a second wiring, the second wiring being connected to the first wiring through a connection terminal, and the second substrate being smaller in area than the first substrate; a first resin layer that is filled in a gap between the first substrate and the second substrate and covers a region, on the first substrate, in an outer periphery of the second substrate; an organic film pattern that is provided on the first substrate and surrounds the first resin layer; and a second resin layer that covers the first substrate, the organic film pattern, the first resin layer, and the second substrate.

主权项

1. A semiconductor device comprising:
a layer of electrically conductive first wiring that is between a first circuit forming layer of a first semiconductor substrate and an electrically insulative first protective film, the first circuit forming layer touches a portion of the first wiring; a layer of electrically conductive second wiring that is between an electrically insulative second protective film and a second circuit forming layer of a second semiconductor substrate smaller than the first semiconductor substrate, the second circuit forming layer touches a portion of the second wiring; a conductive connection terminal that is between the portion of the first wiring and the portion of the second wiring, the portion of the first wiring and the portion of the second wiring touch the conductive connection terminal; a lead-out electrode that touches the first circuit forming layer, the lead-out electrode is provided outside of a peripheral region of the first semiconductor substrate having a segment of the first wiring between the lead-out electrode and the portion of the first wiring; a resin layer that is between the first protective film and the second protective film, the conductive connection terminal is in the resin layer and the resin layer covers the peripheral region, an opposite region that faces the second semiconductor substrate and a portion of the segment of the first wiring in a cross-sectional view uniformly surround the second semiconductor substrate in a plan view; an organic film that touches the resin layer and the lead-out electrode, the organic film completely covers a remaining portion of the segment of the first wiring outside the peripheral region, wherein the resin layer is a material that is different from the organic film, wherein the first protective film is between the organic film and the remaining portion of the segment of the first wiring.