| 发明名称 | Contact pads for integrated circuit packages | ||
| 摘要 | Disclosed herein are contact pads for use with integrated circuit (IC) packages. In some embodiments, a contact pad disclosed herein may be disposed on a substrate of an IC package, and may include a metal projection portion and a metal recess portion. Each of the metal projection portion and the metal recess portion may have a solder contact surface. The solder contact surface of the metal recess portion may be spaced away from the solder contact surface of the metal projection portion. Related devices and techniques are also disclosed herein, and other embodiments may be claimed. | ||
| 申请公布号 | US9368461(B2) | 申请公布日期 | 2016.06.14 |
| 申请号 | US201414280110 | 申请日期 | 2014.05.16 |
| 申请人 | INTEL CORPORATION | 发明人 | Albers Sven;Seidemann Georg;Koller Sonja;Stoeckl Stephan;Sahasrabudhe Shubhada H.;Sane Sandeep B. |
| 分类号 | H01L23/00;H01L23/498 | 主分类号 | H01L23/00 |
| 代理机构 | Schwabe, Williamson & Wyatt, P.C. | 代理人 | Schwabe, Williamson & Wyatt, P.C. |
| 主权项 | 1. A contact pad on a substrate of an integrated circuit (IC) package, the contact pad comprising: a metal projection portion having a solder contact surface; and a metal recess portion having a solder contact surface, wherein the solder contact surface of the metal recess portion is spaced away from the solder contact surface of the metal projection portion and is disposed closer to the substrate, and wherein a footprint of the metal recess portion includes a wave pattern shape of the integrated circuit. | ||
| 地址 | Santa Clara CA US | ||