| 摘要 |
<p>PURPOSE:To enable handling a thinned wafer in the same manner as a normal wafer by supporting a thinned GaAs wafer with a doughnut-shaped metal disc and a doughnut-shaped tape. CONSTITUTION:A metal disc 1 supports a thinned GaAs wafer 2 along with a doughnut-shaped tape 3 and further keeps the randomly curved GaAs wafer 2 planar. As a result, the randomly curved thinned GaAs wafer 2 can be stored in a normally used cassette; therefore, it is possible to apply this holder to an automatic measurement instrument for cassette to cassette.</p> |
