APPARATUS FOR PICKING UP CHIP COMPONENT

摘要

PURPOSE:To reduce a time required for the pickup work or chip components so that irradiation with energy rays and thrust-up work with the thrust pin may be conducted simultaneously in parallel by providing a reflection means which is arranged on the side of the pickup apparatus and reflects energy rays from an energy ray irradiation means to emit them to a chip fixing tape. CONSTITUTION:A total reflection mirror 7 is surfaced with a total reflection layer 7a so as to reflect an ultraviolet ray L entered almost horizontally into an ultraviolet lamp 8 and emit it to a chip fixing tape T. Upon irradiation from the total reflection mirror 7, a thrust pin 4 rises to thrust and float a semiconductor chip C. Since the chip fixing tape T decreases adhesiveness by irradiation with the ultraviolet ray L, the semiconductor chip C is peeled from the periphery by the thrust pin 4. Further, a collet 2 falls in parallel with this action to bring its suction opening 2a into tight contact with the semiconductor chip C for its vacuum suction. When this collet 2 rises, the semiconductor chip is peeled from this chip fixing tape T completely and retained by the collet 2.