发明名称 CONNECTING METHOD OF ELECTROMAGNETIC WAVE SHIELDING LAYER TO GROUND CIRCUIT FOR PRINTED CIRCUIT BOARD
摘要 PURPOSE:To always stabilize connection of an electromagnetic wave shielding layer to a ground circuit by forming an insulating layer of a plurality of insulating layers, gradually increasing in diameter the openings of the ground circuits of the layers toward the layers of the shielding layers. CONSTITUTION:In order to form insulating layers 3a, 3b, and 3d on the upper side of a printed wiring circuit 2, the diameter of the opening of a terminal 5 to be formed at the upper side of a ground terminal 4 of the circuit 2 is gradually increased in diameter from an underresist 3a of the circuit 2 side toward an underresist 3c of an electromagnetic wave shielding layer 6 side with respect to the diameter of the terminal 4 to form an opening of the terminal 5 made of a cuplike recess at the upper side of the terminal 4. The resist 3 is coated with conductive paste such as thermosetting paste by a silk printing method, etc., thereby forming the layer 6.
申请公布号 JPH04793(A) 申请公布日期 1992.01.06
申请号 JP19900102146 申请日期 1990.04.18
申请人 CMK CORP 发明人 OKONOGI HIROTAKA;NIKAIDO KATSUTOMO;ICHIKAWA JUNICHI
分类号 H05K1/02;H05K3/46;H05K9/00;(IPC1-7):H05K9/00 主分类号 H05K1/02
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