APPARATUS FOR TREATING SUBSTRATE

摘要

The present invention provides a device for returning and treating a substrate. According to the embodiment of the present invention, a substrate treating device includes: multiple treating chambers capable of accommodating a substrate; and a returning chamber returning the substrate to the treating chambers. The returning chamber includes: a housing having a returning path in which the substrate is returned; a returning unit capable of moving in the returning path in one direction; and an air current supply unit supplying a fluid forming an air current to the returning path. The air current supply unit supplies the fluid in order for the air current to be formed in the other direction different from the one direction. Therefore, the substrate treating device can minimize pressure difference between an upper area and a lower area in the returning path.