| 摘要 |
The present invention relates to an integrated circuit housing comprising an integrated circuit chip (2), a large number of pins each having a near end and a far end, the chip (2) comprising lands (3) linked by conducting wires to the near ends of the pins, and an encapsulant (7) enclosing the assembly thus constituted while allowing the far ends of the pins to project radially. The pins are distributed into first-level pins (5) arranged in a first plane and into second-level pins (6) arranged in a second plane situated above the first plane, the first-level pins (5) and the second-level pins (6) being spaced vertically by a sheet of electrically insulating material (13). <IMAGE> |
